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At Li-Hong, we create cutting-edge technology solutions
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Cystoscope Connector
Lens + Connector +
Cable Bundle
From the current research direction and the international trend of high-definition electronic endoscopes, it can be seen that the development trend of electronic endoscopes is twofold:
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1. Miniaturization: The size of the probe directly affects the severity of the trauma. Miniaturization of probes can reduce patient pain and discomfort, thereby accelerating postoperative recovery.
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2. High-definition resolution: Since image quality directly affects the application of electronic endoscopes, high resolution remains a focus of endoscope research. Although endoscopes currently reach millions of pixels, medical diagnosis and treatment still require higher resolution endoscopes.
Interposer Connector
Thin-film intermediary technology is another option besides traditional probe techniques. It can create temporary transparent connections between chips and testing equipment, utilizing miniaturized conductive elastomers to form very short electrical paths. This technology offers advantages such as low resistance, ultra-low inductance, and capacitance values. Additionally, it applies low force, thus minimizing damage to the test object. It is particularly effective for products with high frequencies and high currents, ensuring the transmission of the clearest images.
CAMM
Compression Attached Memory Module
CAMM has the following three major characteristics:
a. Capacity upgrade (modules support up to 128GB)
b. Thinner thickness (57% thinner than SO-DIMM, which helps with heat dissipation and releases internal space in notebooks)
c. Performance improvement (Layout can shorten the distance to the CPU by 50% compared to SO-DIMM)
Co-packaged Optics
CPO (Silicon Photonics Connector), the technical specifications of the 3.2 Tb/s Co-Packaged Optics (CPO) transceiver module, including mechanically compatible copper cable connection modules. These devices will serve as fundamental components for establishing low-power solutions to support 51.2Tb/s switches, with 16 modules located near the switch ASIC.
