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CPO 矽光子 LGA Socket
CPO (Co-Packaged Optics) technology involves the integration of EIC (Electronic Integrated Circuit) and PIC (Photonic Integrated Circuit) onto a single carrier board, creating a unified package of modules and chips. This innovation replaces traditional optical transceiver modules, positioning the optical engine in closer proximity to the CPU/GPU, thereby minimizing the electrical transmission path and reducing both transmission loss and signal delay.
Cystoscope Connector
Lens + Connector + Cable Bundle
High-definition electronic endoscopes represent a significant advancement in medical imaging technology, and their development is guided by two primary trends:
1. Miniaturization: Efforts are underway to reduce the size of endoscopic probes, recognizing that the dimensions of these instruments directly impact patient comfort and recovery. By miniaturizing probes, the severity of trauma inflicted during procedures can be minimized, leading to reduced pain and discomfort for patients.
2. High-Definition Resolution: The quality of images produced by electronic endoscopes plays a pivotal role in their clinical utility. Enhancing resolution not only facilitates more accurate visualization of anatomical structures but also enables clinicians to identify subtle abnormalities with greater precision, ultimately improving patient outcomes.
Interposer Connector
Thin-film intermediary technology presents an alternative to conventional probe techniques for establishing connections between chips and testing equipment. This innovative approach involves creating temporary transparent connections using miniaturized conductive elastomers, which enable the formation of extremely short electrical paths.
This technology offers several advantages, including low resistance, ultra-low inductance, and capacitance values. These characteristics contribute to more efficient electrical signal transmission and minimize signal loss, enhancing the overall performance of the testing process.
Furthermore, thin-film intermediary technology applies minimal force during connection, reducing the risk of damage to the test object. This gentle approach is particularly beneficial for delicate components or materials susceptible to mechanical stress.
CAMM (Compression Attached Memory Module)
CAMM boasts three distinctive features:
a. Capacity Upgrade: These modules support memory capacities of up to 128GB, offering significant enhancements in storage capabilities compared to previous memory solutions.
b. Thinner Thickness: CAMM modules are remarkably thin, measuring 57% thinner than traditional SO-DIMM modules. This reduced thickness not only contributes to improved heat dissipation but also frees up internal space within notebooks, allowing for more efficient design and layout.
c. Performance Improvement: The layout of CAMM modules enables a notable improvement in performance by shortening the distance to the CPU by 50% compared to SO-DIMM modules. This reduction in distance enhances data transfer speeds and overall system responsiveness, resulting in a smoother user experience.
Co-packaged Optics
The CPO (Silicon Photonics Connector) represents a significant advancement in optical communication technology, offering unparalleled data transmission capabilities. With a technical specification of 3.2 Tb/s, the Co-Packaged Optics (CPO) transceiver module stands out as a groundbreaking solution in the field of high-speed data transmission.
In addition to its impressive data transmission capabilities, the CPO module also features mechanically compatible copper cable connection modules. This compatibility ensures seamless integration with existing infrastructure, making it easier for businesses to adopt this cutting-edge technology without requiring extensive modifications to their networking systems.
These CPO modules are poised to become integral components in the development of low-power solutions designed to support high-capacity switches. With the ability to handle up to 51.2 Tb/s of data transmission, these modules offer unparalleled performance and scalability. Furthermore, by strategically placing 16 modules near the switch ASIC, the overall efficiency and effectiveness of data transmission can be maximized, ensuring seamless connectivity and optimal performance.
Ultrafine Probe
Contact probes, also known as inspection pins, play a crucial role in the realm of electronic testing and quality assurance. These specialized tools are designed to facilitate electrical and functional tests across a wide range of components and devices, including semiconductors, liquid crystal panels, printed circuit boards (PCBs), flexible printed circuits (FPCs), connectors, and more.
Their primary function is to establish temporary electrical connections with the target device or component, allowing for precise measurement and analysis of various parameters such as voltage, current, resistance, and signal integrity. By making direct contact with specific points on the device under test, contact probes enable technicians and engineers to assess its performance, identify potential faults or defects, and verify compliance with design specifications.
Contact probes come in various shapes, sizes, and configurations to accommodate different testing requirements and device geometries. They may feature different tip styles, such as pointed, flat, or spring-loaded tips, to ensure optimal contact and reliable signal transmission. Additionally, some contact probes may incorporate advanced features such as built-in spring mechanisms or self-cleaning contacts to enhance durability and longevity.